The National Institute of Standards and Technology, part of the U.S. Department of Commerce, is awarding up to $100 million to Arizona State University (ASU) and Deca Technologies for the SHIELD USA initiative. This project aims to drive innovation in the domestic microchip packaging ecosystem and help the U.S. regain leadership in microelectronics while strengthening national security. The initiative is part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP) and is the first of several research and development programs to be launched.
SHIELD USA will focus on developing advanced substrates that enable high-performance computing, artificial intelligence, and more efficient power electronics. By accelerating research and commercial deployment, strengthening domestic supply chains, expanding workforce and research capacity, and supporting U.S. leadership in semiconductor packaging, the initiative aims to bring substrate manufacturing back to the U.S. and establish a sustainable domestic supply chain.
ASU President Michael Crow highlighted the importance of the initiative in determining the future of innovation in semiconductor chip manufacturing. Deca Technologies’ Chief Technology Officer, Craig Bishop, emphasized the need for “10X breakthroughs” to drive innovation in the industry. The initiative will leverage ASU’s expertise and Deca Technologies’ proven technologies to establish a domestic ecosystem for advanced packaging service providers.
Key semiconductor companies such as AMD, IBM, and NXP, along with domestic packaging manufacturers, are collaborating on the initiative to scale and deploy the technology in U.S.-based facilities. U.S. Secretary of Commerce Gina Raimondo stressed the importance of out-innovating and out-building the rest of the world to ensure long-term competitiveness. SHIELD USA’s education and workforce development programs will support the human capital necessary for sustainable domestic packaging research and manufacturing.
Source
Photo credit news.asu.edu
